Update readme.md

Soldering/Reflow Soldering/readme.md

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 Currently, the School of Electronics, Computing and Mathematics (CEM) has a working re-flow machine, which is available to students to use for coursework and project work. To make arangements for the use of the machine, please talk to (or e-mail) the CEM electronics technical team (e-mail - TechTeamCEM@coventry.ac.uk). In this folder, a guide ("How to set up the CEM Re-flow Machine.pdf) on how set up the machine can be found and it is a mandatory read for anyone who wishes to use the machine. All details about the supported solder pastes stocked at the University can also be found here: *https://github.coventry.ac.uk/ab1816/DATAINFO/tree/master/Soldering/Solder%20Pastes*
 
-# __Reflow Soldering__
+# __Re-flow Soldering__
 
-Reflow soldering is the most widely used method of attaching surface mount components to printed circuit boards (PCBs). The aim of the process is to form acceptable solder joints by first pre-heating the components/PCB/solder paste and then melting the solder without causing damage by overheating.
+Re-flow soldering is the most widely used method of attaching surface mount components to printed circuit boards (PCBs). The aim of the process is to form acceptable solder joints by first pre-heating the components/PCB/solder paste and then melting the solder without causing damage by overheating.
 
 * __For full details on re-flow soldering techniques visit:__ *http://www.surfacemountprocess.com/reflow-soldering-process.html*